Description
BMW ID6 digital instrument cluster repair CPU chip BGA reballing stencil
The stencil and positioning plate For reballing the FCPBGA624 chip MCIMX6D6AVT08AD, MCIMX6D6AVT08AC, MCIMX6D6AVT10AD or other MCIMX6QxAxxxx, MCIMX6DxAxxxx series BGA chip, 21 x 21 mm, 0.8 mm pitch.










Reviews
There are no reviews yet.