Description
BMW ID6 digital instrument cluster repair CPU chip BGA reballing stencil
The stencil and positioning plate For reballing the FCPBGA624 chip MCIMX6D6AVT08AD, MCIMX6D6AVT08AC, MCIMX6D6AVT10AD, MCIMX6DP4AVT1AA or other MCIMX6QxAxxxx, MCIMX6DxAxxxx series BGA chip, 21 x 21 mm, 0.8 mm pitch.










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